The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
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The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Cet article propose la nouvelle série de modules de puissance intelligents (IPM) hautement intégrés, développés pour fournir un système d'entraînement moteur ultra-compact, hautes performances et fiable. Des détails sur les technologies de conception clés de l'IPM sont donnés et des problèmes d'application pratiques tels que les caractéristiques électriques, les performances de fonctionnement du système et la dissipation de puissance sont discutés. Le placement et le routage de la configuration ont été optimisés afin de réduire et d'équilibrer les impédances parasites. En mettant en œuvre un substrat céramique innovant en cuivre à liaison directe (DBC), capable de dissiper efficacement la chaleur, l'IPM offre des étages de puissance entièrement intégrés comprenant deux onduleurs triphasés, une correction du facteur de puissance (PFC) et un redresseur dans un boîtier ultra-compact de 75.5 mm × Boîtier de 30 mm, offrant un espace jusqu'à 17.3 % plus petit que le système d'entraînement moteur traditionnel.
Huanyu WANG
Shandong Normal University
Lina HUANG
Shandong Normal University
Yutong LIU
Shandong Normal University
Zhenyuan XU
Shandong Normal University
Lu ZHANG
Shandong Normal University
Tuming ZHANG
Guangdong HIIC Semiconductor Co., LTD.
Yuxiang FENG
Guangdong HIIC Semiconductor Co., LTD.,South China University of Technology
Qing HUA
Shandong Normal University
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Huanyu WANG, Lina HUANG, Yutong LIU, Zhenyuan XU, Lu ZHANG, Tuming ZHANG, Yuxiang FENG, Qing HUA, "Highly Integrated DBC-Based IPM with Ultra-Compact Size for Low Power Motor Drive Applications" in IEICE TRANSACTIONS on Electronics,
vol. E106-C, no. 8, pp. 442-445, August 2023, doi: 10.1587/transele.2022ECS6014.
Abstract: This paper proposes the new series highly integrated intelligent power module (IPM), which is developed to provide a ultra-compact, high performance and reliable motor drive system. Details of the key design technologies of the IPM is given and practical application issues such as electrical characteristics, system operation performance and power dissipation are discussed. Layout placement and routing have been optimized in order to reduce and balance the parasitic impedances. By implementing an innovative direct bonding copper (DBC) ceramic substrate, which can effectively dissipate heat, the IPM delivers a fully integrated power stages including two three-phase inverters, power factor correction (PFC) and rectifier in an ultra-compact 75.5mm × 30mm package, offering up to a 17.3 percent smaller space than traditional motor drive scheme.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2022ECS6014/_p
Copier
@ARTICLE{e106-c_8_442,
author={Huanyu WANG, Lina HUANG, Yutong LIU, Zhenyuan XU, Lu ZHANG, Tuming ZHANG, Yuxiang FENG, Qing HUA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Highly Integrated DBC-Based IPM with Ultra-Compact Size for Low Power Motor Drive Applications},
year={2023},
volume={E106-C},
number={8},
pages={442-445},
abstract={This paper proposes the new series highly integrated intelligent power module (IPM), which is developed to provide a ultra-compact, high performance and reliable motor drive system. Details of the key design technologies of the IPM is given and practical application issues such as electrical characteristics, system operation performance and power dissipation are discussed. Layout placement and routing have been optimized in order to reduce and balance the parasitic impedances. By implementing an innovative direct bonding copper (DBC) ceramic substrate, which can effectively dissipate heat, the IPM delivers a fully integrated power stages including two three-phase inverters, power factor correction (PFC) and rectifier in an ultra-compact 75.5mm × 30mm package, offering up to a 17.3 percent smaller space than traditional motor drive scheme.},
keywords={},
doi={10.1587/transele.2022ECS6014},
ISSN={1745-1353},
month={August},}
Copier
TY - JOUR
TI - Highly Integrated DBC-Based IPM with Ultra-Compact Size for Low Power Motor Drive Applications
T2 - IEICE TRANSACTIONS on Electronics
SP - 442
EP - 445
AU - Huanyu WANG
AU - Lina HUANG
AU - Yutong LIU
AU - Zhenyuan XU
AU - Lu ZHANG
AU - Tuming ZHANG
AU - Yuxiang FENG
AU - Qing HUA
PY - 2023
DO - 10.1587/transele.2022ECS6014
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E106-C
IS - 8
JA - IEICE TRANSACTIONS on Electronics
Y1 - August 2023
AB - This paper proposes the new series highly integrated intelligent power module (IPM), which is developed to provide a ultra-compact, high performance and reliable motor drive system. Details of the key design technologies of the IPM is given and practical application issues such as electrical characteristics, system operation performance and power dissipation are discussed. Layout placement and routing have been optimized in order to reduce and balance the parasitic impedances. By implementing an innovative direct bonding copper (DBC) ceramic substrate, which can effectively dissipate heat, the IPM delivers a fully integrated power stages including two three-phase inverters, power factor correction (PFC) and rectifier in an ultra-compact 75.5mm × 30mm package, offering up to a 17.3 percent smaller space than traditional motor drive scheme.
ER -