The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Cet article propose une conception d'interconnexion à grande vitesse entre des modules optiques et des modules électriques via des fils de liaison et des lignes de transmission de guides d'ondes coplanaires sur des cartes de circuits imprimés pour des systèmes de communication optiques à 400 canaux de 4 Gbit/s. Afin d'élargir la bande passante d'interconnexion, des condensateurs interdigités ont été intégrés pour la première fois aux plots GSG sur puce. Les résultats de simulation indiquent que le coefficient de réflexion est inférieur à -10 dB de DC à 53 GHz et que la perte d'insertion est inférieure à 1 dB de DC à 45 GHz. Les deux indicateurs montrent que la structure d'interconnexion proposée peut répondre efficacement aux exigences de bande passante de communication des signaux PAM100 à débit de données de 4 Gbit/s ou même supérieur.
Xiangyu MENG
Sun Yat-sen University
Yecong LI
Sun Yat-sen University
Zhiyi YU
Sun Yat-sen University
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Copier
Xiangyu MENG, Yecong LI, Zhiyi YU, "A Low Insertion Loss Wideband Bonding-Wire Based Interconnection for 400 Gbps PAM4 Transceivers" in IEICE TRANSACTIONS on Electronics,
vol. E106-C, no. 1, pp. 14-19, January 2023, doi: 10.1587/transele.2022ECP5011.
Abstract: This paper proposes a design of high-speed interconnection between optical modules and electrical modules via bonding-wires and coplanar waveguide transmission lines on printed circuit boards for 400 Gbps 4-channel optical communication systems. In order to broaden the interconnection bandwidth, interdigitated capacitors were integrated with GSG pads on chip for the first time. Simulation results indicate the reflection coefficient is below -10 dB from DC to 53 GHz and the insertion loss is below 1 dB from DC to 45 GHz. Both indicators show that the proposed interconnection structure can effectively satisfy the communication bandwidth requirements of 100-Gbps or even higher data-rate PAM4 signals.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2022ECP5011/_p
Copier
@ARTICLE{e106-c_1_14,
author={Xiangyu MENG, Yecong LI, Zhiyi YU, },
journal={IEICE TRANSACTIONS on Electronics},
title={A Low Insertion Loss Wideband Bonding-Wire Based Interconnection for 400 Gbps PAM4 Transceivers},
year={2023},
volume={E106-C},
number={1},
pages={14-19},
abstract={This paper proposes a design of high-speed interconnection between optical modules and electrical modules via bonding-wires and coplanar waveguide transmission lines on printed circuit boards for 400 Gbps 4-channel optical communication systems. In order to broaden the interconnection bandwidth, interdigitated capacitors were integrated with GSG pads on chip for the first time. Simulation results indicate the reflection coefficient is below -10 dB from DC to 53 GHz and the insertion loss is below 1 dB from DC to 45 GHz. Both indicators show that the proposed interconnection structure can effectively satisfy the communication bandwidth requirements of 100-Gbps or even higher data-rate PAM4 signals.},
keywords={},
doi={10.1587/transele.2022ECP5011},
ISSN={1745-1353},
month={January},}
Copier
TY - JOUR
TI - A Low Insertion Loss Wideband Bonding-Wire Based Interconnection for 400 Gbps PAM4 Transceivers
T2 - IEICE TRANSACTIONS on Electronics
SP - 14
EP - 19
AU - Xiangyu MENG
AU - Yecong LI
AU - Zhiyi YU
PY - 2023
DO - 10.1587/transele.2022ECP5011
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E106-C
IS - 1
JA - IEICE TRANSACTIONS on Electronics
Y1 - January 2023
AB - This paper proposes a design of high-speed interconnection between optical modules and electrical modules via bonding-wires and coplanar waveguide transmission lines on printed circuit boards for 400 Gbps 4-channel optical communication systems. In order to broaden the interconnection bandwidth, interdigitated capacitors were integrated with GSG pads on chip for the first time. Simulation results indicate the reflection coefficient is below -10 dB from DC to 53 GHz and the insertion loss is below 1 dB from DC to 45 GHz. Both indicators show that the proposed interconnection structure can effectively satisfy the communication bandwidth requirements of 100-Gbps or even higher data-rate PAM4 signals.
ER -