The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
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The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Nous proposons dans cet article un modèle compact de jonction tunnel magnétique (MTJ) pour la simulation de circuits par la norme de facto SPICE. Il est implémenté par le langage Verilog-A, ce qui facilite la simulation des MTJ avec d'autres appareils standard. Sur la base de la probabilité de commutation, nous connectons en douceur le modèle de précession adiabatique et le modèle d'activation thermique en utilisant une technique d'interpolation basée sur la méthode du spline cubique. Nous pouvons prédire le temps de commutation après l'application d'un courant. Parallèlement, nous utilisons des modèles physiques appropriés pour décrire d’autres caractéristiques du MTJ. Les résultats de la simulation valident que le modèle est cohérent avec les données expérimentales et efficace pour la simulation de circuits hybrides MTJ/CMOS.
Haoyan LIU
Waseda University
Takashi OHSAWA
Waseda University
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Haoyan LIU, Takashi OHSAWA, "Compact Model of Magnetic Tunnel Junctions for SPICE Simulation Based on Switching Probability" in IEICE TRANSACTIONS on Electronics,
vol. E104-C, no. 3, pp. 121-127, March 2021, doi: 10.1587/transele.2020ECP5011.
Abstract: We propose a compact magnetic tunnel junction (MTJ) model for circuit simulation by de-facto standard SPICE in this paper. It is implemented by Verilog-A language which makes it easy to simulate MTJs with other standard devices. Based on the switching probability, we smoothly connect the adiabatic precessional model and the thermal activation model by using an interpolation technique based on the cubic spline method. We can predict the switching time after a current is applied. Meanwhile, we use appropriate physical models to describe other MTJ characteristics. Simulation results validate that the model is consistent with experimental data and effective for MTJ/CMOS hybrid circuit simulation.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2020ECP5011/_p
Copier
@ARTICLE{e104-c_3_121,
author={Haoyan LIU, Takashi OHSAWA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Compact Model of Magnetic Tunnel Junctions for SPICE Simulation Based on Switching Probability},
year={2021},
volume={E104-C},
number={3},
pages={121-127},
abstract={We propose a compact magnetic tunnel junction (MTJ) model for circuit simulation by de-facto standard SPICE in this paper. It is implemented by Verilog-A language which makes it easy to simulate MTJs with other standard devices. Based on the switching probability, we smoothly connect the adiabatic precessional model and the thermal activation model by using an interpolation technique based on the cubic spline method. We can predict the switching time after a current is applied. Meanwhile, we use appropriate physical models to describe other MTJ characteristics. Simulation results validate that the model is consistent with experimental data and effective for MTJ/CMOS hybrid circuit simulation.},
keywords={},
doi={10.1587/transele.2020ECP5011},
ISSN={1745-1353},
month={March},}
Copier
TY - JOUR
TI - Compact Model of Magnetic Tunnel Junctions for SPICE Simulation Based on Switching Probability
T2 - IEICE TRANSACTIONS on Electronics
SP - 121
EP - 127
AU - Haoyan LIU
AU - Takashi OHSAWA
PY - 2021
DO - 10.1587/transele.2020ECP5011
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E104-C
IS - 3
JA - IEICE TRANSACTIONS on Electronics
Y1 - March 2021
AB - We propose a compact magnetic tunnel junction (MTJ) model for circuit simulation by de-facto standard SPICE in this paper. It is implemented by Verilog-A language which makes it easy to simulate MTJs with other standard devices. Based on the switching probability, we smoothly connect the adiabatic precessional model and the thermal activation model by using an interpolation technique based on the cubic spline method. We can predict the switching time after a current is applied. Meanwhile, we use appropriate physical models to describe other MTJ characteristics. Simulation results validate that the model is consistent with experimental data and effective for MTJ/CMOS hybrid circuit simulation.
ER -