The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
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The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
La hiérarchie des emballages n’est pas une structure fixe. Il peut être modifié en fonction de la technologie de conditionnement elle-même, et le nombre de niveaux hiérarchiques a tendance à diminuer. Dans la technologie des boîtiers LSI, y compris les interconnexions boîtier-carte, il y a eu deux changements évolutifs. La première évolution est passée du PTH au SMT, et la deuxième évolution est passée des « connexions périphériques » aux « connexions de réseau de zones ». Ces évolutions ont été provoquées par l'intégration des circuits intégrés et les exigences des produits d'application. Aujourd’hui, la troisième évolution semble être en cours, celle du SCP au MCP ou SIP. Bien que le SoC possède de nombreuses fonctionnalités remarquables, il n’a pas été appliqué à de nombreux systèmes contrairement aux attentes, et ses limites ou problèmes sont devenus clairs. SIP est la réponse aux problèmes ci-dessus liés au SoC. MCP peut être considéré comme un SIP primitif. L’objectif de MCP est de combler le fossé technologique entre SMT et SoC pour résoudre les problèmes. Les cibles du SIP sont principalement les deux éléments suivants. (1) Surmonter la crise d’interconnexion des SoC. (2) Ouverture de nouveaux champs d'application en électronique. Afin d'atteindre ces objectifs, plusieurs consortiums dans le monde effectuent des recherches et développent des technologies de base.
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Akihiro DOHYA, "Packaging Technology Trends and Challenges for System-in-Package" in IEICE TRANSACTIONS on Electronics,
vol. E84-C, no. 12, pp. 1756-1762, December 2001, doi: .
Abstract: The packaging hierarchy is not fixed structure. It can be changed depending on the packaging technology itself, and the number of hierarchy levels tends to decrease. In LSI-package technology including package-to-board interconnections, there were two evolutionary changes. The first evolution was from PTH to SMT, and the second evolution was from "Peripheral connections" to "Area-array connections. " These evolutions have been caused by ICs integration and application products requirements. Now, the third evolution appears to be in progress, which is from SCP to MCP or SIP. Although SoC has many remarkable features, it has been not applied for many systems contrary to expectations, and its limitations or issues have become clear. SIP is the answer for above SoC's issues. MCP can be considered to be primitive SIP. The purpose of MCP is making up the technology gap between SMT and SoC to address the issues. The targets of SIP are mainly the next two items. (1) Overcoming the interconnection crisis of SoC. (2) Opening new application fields in electronics. In order to achieve those targets, several consortiums in the world are doing research and developing core technologies.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e84-c_12_1756/_p
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@ARTICLE{e84-c_12_1756,
author={Akihiro DOHYA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Packaging Technology Trends and Challenges for System-in-Package},
year={2001},
volume={E84-C},
number={12},
pages={1756-1762},
abstract={The packaging hierarchy is not fixed structure. It can be changed depending on the packaging technology itself, and the number of hierarchy levels tends to decrease. In LSI-package technology including package-to-board interconnections, there were two evolutionary changes. The first evolution was from PTH to SMT, and the second evolution was from "Peripheral connections" to "Area-array connections. " These evolutions have been caused by ICs integration and application products requirements. Now, the third evolution appears to be in progress, which is from SCP to MCP or SIP. Although SoC has many remarkable features, it has been not applied for many systems contrary to expectations, and its limitations or issues have become clear. SIP is the answer for above SoC's issues. MCP can be considered to be primitive SIP. The purpose of MCP is making up the technology gap between SMT and SoC to address the issues. The targets of SIP are mainly the next two items. (1) Overcoming the interconnection crisis of SoC. (2) Opening new application fields in electronics. In order to achieve those targets, several consortiums in the world are doing research and developing core technologies.},
keywords={},
doi={},
ISSN={},
month={December},}
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TY - JOUR
TI - Packaging Technology Trends and Challenges for System-in-Package
T2 - IEICE TRANSACTIONS on Electronics
SP - 1756
EP - 1762
AU - Akihiro DOHYA
PY - 2001
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E84-C
IS - 12
JA - IEICE TRANSACTIONS on Electronics
Y1 - December 2001
AB - The packaging hierarchy is not fixed structure. It can be changed depending on the packaging technology itself, and the number of hierarchy levels tends to decrease. In LSI-package technology including package-to-board interconnections, there were two evolutionary changes. The first evolution was from PTH to SMT, and the second evolution was from "Peripheral connections" to "Area-array connections. " These evolutions have been caused by ICs integration and application products requirements. Now, the third evolution appears to be in progress, which is from SCP to MCP or SIP. Although SoC has many remarkable features, it has been not applied for many systems contrary to expectations, and its limitations or issues have become clear. SIP is the answer for above SoC's issues. MCP can be considered to be primitive SIP. The purpose of MCP is making up the technology gap between SMT and SoC to address the issues. The targets of SIP are mainly the next two items. (1) Overcoming the interconnection crisis of SoC. (2) Opening new application fields in electronics. In order to achieve those targets, several consortiums in the world are doing research and developing core technologies.
ER -