The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
La résistance de contact de la galvanoplastie en or durci au nickel (NiHG) déposée sur des coupons de disque en bronze phosphoreux sous-plaqués de nickel (substrat) après vieillissement thermique a été mesurée avec une sonde à broche en alliage de cuivre-béryllium plaqué or dur au moyen d'une technique de sonde à quatre points, comparée à celle de la galvanoplastie en or durci au cobalt (CoHG). La surface des coupons plaqués NiHG après vieillissement a été analysée par spectroscopie photoélectronique à rayons X (XPS) pour étudier l'influence de la formation d'un film d'oxyde pendant le vieillissement thermique sur la résistance de contact de la galvanoplastie NiHG, par rapport à celle du CoHG. La résistance de contact initiale des coupons NiHG était inférieure à 10 mΩ pour des forces de contact supérieures à 0.05 N, augmentée à 10 mΩ pour une force de contact de 0.05 N après 100 heures de vieillissement à 200
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Hisao KUMAKURA, Makoto SEKIGUCHI, "Increase in Contact Resistance of Hard Gold Plating during Thermal Aging -- Nickel-Hardened Gold and Cobalt-Hardened Gold --" in IEICE TRANSACTIONS on Electronics,
vol. E82-C, no. 1, pp. 13-18, January 1999, doi: .
Abstract: Contact resistance of nickel hardened gold electroplate (NiHG) deposited on nickel-underplated phosphor bronze disk coupons (substrate) after thermal aging was measured with a hard gold-plated beryllium copper alloy pin probe by means of a four-point probe technique, compared to that of cobalt-hardened gold electroplate (CoHG). Surface of NiHG plated coupons after aging was analyzed by X-ray photoelectron spectroscopy (XPS) to investigate the influence of the oxide film formation during thermal aging on contact resistance of NiHG electroplate, compared to that of CoHG. Initial contact resistance of the NiHG coupons was less than 10 mΩ at a contact forces more than 0.05 N, increased to 10 mΩ at a contact force of 0.05 N after 100 hours aging at 200
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e82-c_1_13/_p
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@ARTICLE{e82-c_1_13,
author={Hisao KUMAKURA, Makoto SEKIGUCHI, },
journal={IEICE TRANSACTIONS on Electronics},
title={Increase in Contact Resistance of Hard Gold Plating during Thermal Aging -- Nickel-Hardened Gold and Cobalt-Hardened Gold --},
year={1999},
volume={E82-C},
number={1},
pages={13-18},
abstract={Contact resistance of nickel hardened gold electroplate (NiHG) deposited on nickel-underplated phosphor bronze disk coupons (substrate) after thermal aging was measured with a hard gold-plated beryllium copper alloy pin probe by means of a four-point probe technique, compared to that of cobalt-hardened gold electroplate (CoHG). Surface of NiHG plated coupons after aging was analyzed by X-ray photoelectron spectroscopy (XPS) to investigate the influence of the oxide film formation during thermal aging on contact resistance of NiHG electroplate, compared to that of CoHG. Initial contact resistance of the NiHG coupons was less than 10 mΩ at a contact forces more than 0.05 N, increased to 10 mΩ at a contact force of 0.05 N after 100 hours aging at 200
keywords={},
doi={},
ISSN={},
month={January},}
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TY - JOUR
TI - Increase in Contact Resistance of Hard Gold Plating during Thermal Aging -- Nickel-Hardened Gold and Cobalt-Hardened Gold --
T2 - IEICE TRANSACTIONS on Electronics
SP - 13
EP - 18
AU - Hisao KUMAKURA
AU - Makoto SEKIGUCHI
PY - 1999
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E82-C
IS - 1
JA - IEICE TRANSACTIONS on Electronics
Y1 - January 1999
AB - Contact resistance of nickel hardened gold electroplate (NiHG) deposited on nickel-underplated phosphor bronze disk coupons (substrate) after thermal aging was measured with a hard gold-plated beryllium copper alloy pin probe by means of a four-point probe technique, compared to that of cobalt-hardened gold electroplate (CoHG). Surface of NiHG plated coupons after aging was analyzed by X-ray photoelectron spectroscopy (XPS) to investigate the influence of the oxide film formation during thermal aging on contact resistance of NiHG electroplate, compared to that of CoHG. Initial contact resistance of the NiHG coupons was less than 10 mΩ at a contact forces more than 0.05 N, increased to 10 mΩ at a contact force of 0.05 N after 100 hours aging at 200
ER -