The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Dans cet article, l'évaluation de l'émission d'un PCB en utilisant la diaphonie entre une trace de signal basse fréquence et une trace de signal numérique est étudiée. Ces traces de signaux sont acheminées étroitement et parallèlement les unes aux autres sur les différents plans de signaux du PCB. Il est démontré expérimentalement que la trace du signal couplée à une section de câble provoque une augmentation drastique des émissions du PCB. A partir des résultats de mesure de la répartition du courant sur la section de câble, il est montré que cette répartition du courant contribue à l'augmentation des émissions du PCB. Par conséquent, l’augmentation de l’émission par couplage entre les traces de signal est évaluée par diaphonie entre elles. Les résultats de mesure du rayonnement et les résultats de calcul de la diaphonie sur le PCB (écart par rapport aux résultats du PCB auquel il est fait référence, respectivement) concordent entre eux dans une plage de 2 dB ou une plage de 3.5 dB. Ce résultat montre que l'effet de réduction des émissions du PCB peut être prédit par les résultats du calcul de la diaphonie. De plus, il est démontré que l'évaluation du niveau d'émission à l'aide de la diaphonie est utile pour décider de la structure du PCB en vue de réduire les émissions d'un PCB assemblé à haute densité. Du point de vue de l'application pratique, il est efficace pour réduire les émissions d'un PCB de séparer une trace de signal basse fréquence d'une trace de signal numérique à grande vitesse par le plan de masse d'un PCB.
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Copier
Naoto OKA, Chiharu MIYAZAKI, Shuichi NITTA, "Evaluation of Emission from a PCB by Using Crosstalk between a Low Frequency Signal Trace and a Digital Signal Trace" in IEICE TRANSACTIONS on Communications,
vol. E83-B, no. 3, pp. 586-592, March 2000, doi: .
Abstract: In this paper, the evaluation of emission from a PCB by using crosstalk between a low frequency signal trace and a digital signal trace is investigated. These signal traces are closely routed in parallel to each other on the different several signal planes in the PCB. It is shown experimentally that the coupled signal trace with a cable section causes drastic increase of emission from the PCB. From the measurement results of current distribution on the cable section, it is shown that this current distribution contributes to the increase of emission from the PCB. Therefore, emission increasing by coupling between signal traces is evaluated by crosstalk between them. The measurement results of radiation and the calculation results of crosstalk on the PCB (deviation from results of the PCB which is referred, respectively) agree with each other within 2 dB range or 3.5 dB range. This result shows that reduction effect of emission from the PCB can be predicted by calculation results of crosstalk. Moreover, it is shown that evaluation of emission level by using crosstalk is useful to decide PCB's structure for reduction of emission from a high-density assembled PCB. From the viewpoint of practical application, it is effective for the reduction of emission from a PCB to separate a low frequency signal trace from a high-speed digital signal trace by ground plane of a PCB.
URL: https://global.ieice.org/en_transactions/communications/10.1587/e83-b_3_586/_p
Copier
@ARTICLE{e83-b_3_586,
author={Naoto OKA, Chiharu MIYAZAKI, Shuichi NITTA, },
journal={IEICE TRANSACTIONS on Communications},
title={Evaluation of Emission from a PCB by Using Crosstalk between a Low Frequency Signal Trace and a Digital Signal Trace},
year={2000},
volume={E83-B},
number={3},
pages={586-592},
abstract={In this paper, the evaluation of emission from a PCB by using crosstalk between a low frequency signal trace and a digital signal trace is investigated. These signal traces are closely routed in parallel to each other on the different several signal planes in the PCB. It is shown experimentally that the coupled signal trace with a cable section causes drastic increase of emission from the PCB. From the measurement results of current distribution on the cable section, it is shown that this current distribution contributes to the increase of emission from the PCB. Therefore, emission increasing by coupling between signal traces is evaluated by crosstalk between them. The measurement results of radiation and the calculation results of crosstalk on the PCB (deviation from results of the PCB which is referred, respectively) agree with each other within 2 dB range or 3.5 dB range. This result shows that reduction effect of emission from the PCB can be predicted by calculation results of crosstalk. Moreover, it is shown that evaluation of emission level by using crosstalk is useful to decide PCB's structure for reduction of emission from a high-density assembled PCB. From the viewpoint of practical application, it is effective for the reduction of emission from a PCB to separate a low frequency signal trace from a high-speed digital signal trace by ground plane of a PCB.},
keywords={},
doi={},
ISSN={},
month={March},}
Copier
TY - JOUR
TI - Evaluation of Emission from a PCB by Using Crosstalk between a Low Frequency Signal Trace and a Digital Signal Trace
T2 - IEICE TRANSACTIONS on Communications
SP - 586
EP - 592
AU - Naoto OKA
AU - Chiharu MIYAZAKI
AU - Shuichi NITTA
PY - 2000
DO -
JO - IEICE TRANSACTIONS on Communications
SN -
VL - E83-B
IS - 3
JA - IEICE TRANSACTIONS on Communications
Y1 - March 2000
AB - In this paper, the evaluation of emission from a PCB by using crosstalk between a low frequency signal trace and a digital signal trace is investigated. These signal traces are closely routed in parallel to each other on the different several signal planes in the PCB. It is shown experimentally that the coupled signal trace with a cable section causes drastic increase of emission from the PCB. From the measurement results of current distribution on the cable section, it is shown that this current distribution contributes to the increase of emission from the PCB. Therefore, emission increasing by coupling between signal traces is evaluated by crosstalk between them. The measurement results of radiation and the calculation results of crosstalk on the PCB (deviation from results of the PCB which is referred, respectively) agree with each other within 2 dB range or 3.5 dB range. This result shows that reduction effect of emission from the PCB can be predicted by calculation results of crosstalk. Moreover, it is shown that evaluation of emission level by using crosstalk is useful to decide PCB's structure for reduction of emission from a high-density assembled PCB. From the viewpoint of practical application, it is effective for the reduction of emission from a PCB to separate a low frequency signal trace from a high-speed digital signal trace by ground plane of a PCB.
ER -